OCTOWINANDI, Vivin et al.
Pengukuran Kemampuan Manufaktur PCB Empat Layer di TFME.
Journal of Applied Electrical Engineering, [S.l.], v. 8, n. 1, p. 17-23, june 2024.
ISSN 2548-9682.
Available at: <http://704209.wb34atkl.asia/index.php/JAEE/article/view/6991>. Date accessed: 28 nov. 2024.
doi: https://doi.org/10.30871/jaee.v8i1.6991.