Penggunaan SEM dan Image-J dalam Mempelajari Ketebalan Lapisan Mikrostruktur
Abstract
Telah dilakukan penelitian terkait dengan ketebalan lapisan mikrostruktur dengan menggunakan SEM (Scanning Electron Microscope) dan Image-J. Sampel diuji dengan menggunakan SEM untuk mendapatkan mikrostruktur dari sampel. Setelah mikrostruktur didapatkan maka dilakukan analisa ketebalan lapisan mikrostruktur dengan menggunakan teknik pengukuran secara langsung menggunakan SEM dan teknik pengukuran tidak langsung menggunakan aplikasi Image-J. Berdasarkan hasil penelitian yang telah dilakukan, pengukuran ketebalan lapisan dengan menggunakan SEM dan Image-J menunjukkan pola kurva yang sama untuk semua ketebalan lapisan. Persentase perbedaan pengukuran ketebalan lapisan dengan menggunakan SEM dan Image J adalah 0.7% untuk lapisan ke-1, 1,6 % untuk lapisan ke-2 dan 0.8 % untuk lapisan ke-3. Persentase perbedaan tersebut sangat kecil (<2%) sehingga aplikasi Image-J ini dapat digunakan sebagai alternatif di dalam pengukuran ketebalan lapisan mikrostruktur
References
[2] G. S. Wable, S. Chada, B. Neal, and R. A. Fournelle, “Solidification shrinkage defects in electronic solders,” JOM 2005 57:6, vol. 57, no. 6, pp. 38–42, 2005, doi: 10.1007/S11837-005-0134-X.
[3] S. A. Sayid, A. Dadan-Garba, D. E. Enenche, and B. A. Ikyo, “Scanning Electron Microscopy (SEM) of the Bug Eye and Sand Coral,” undefined, vol. 08, no. 01, pp. 1–7, 2020, doi: 10.4236/MR.2020.81001.
[4] A. A. Bogno, J. E. Spinelli, C. R. M. Afonso, and H. Henein, “Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy,” Journal of Materials Research and Technology, vol. 4, no. 1, pp. 84–92, Jan. 2015, doi: 10.1016/J.JMRT.2014.12.005.
[5] O. Mokhtari and H. Nishikawa, “Effects of in and Ni addition on icrostructure of Sn-58Bi solder joint,” Journal of Electronic Materials, vol. 43, no. 11, pp. 4158–4170, Nov. 2014, doi: 10.1007/S11664-014-3359-Z.
[6] U. Ali, H. Khan, M. Aamir, K. Giasin, N. Habib, and M. Owais Awan, “Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature,” Metals 2021, Vol. 11, Page 1077, vol. 11, no. 7, p. 1077, Jul. 2021, doi: 10.3390/MET11071077.
[7] B. Budiana, F. Nakul, N. Wivanius, B. Sugandi, and R. Yolanda, “Analisis Kekasaran Permukaan Besi ASTM36 dengan menggunakan Surftest dan Image –J,” Journal of Applied Electrical Engineering, vol. 4, no. 2, pp. 49–54, Dec. 2020, doi: 10.30871/JAEE.V4I2.2747.
[8] M. A. Hossain, P. Khan, C. C. Lu, and R. J. Clements, “Distributed ImageJ (Fiji): A framework for parallel image processing,” IET Image Processing, vol. 14, no. 12, pp. 2937–2947, Oct. 2020, doi: 10.1049/IET-IPR.2019.0150/CITE/REFWORKS.
[9] A. Ullah, G. Liu, H. Wang, D. F. Khan, and M. Khan, “A framework for image processing, analysis and visualization of materials microstructures using ImageJ package,” undefined, 2012.
[10] T. Qasim, C. Ford, M. Bongué-Boma, M. B. Bush, and X. Z. Hu, “Effect of coating thickness on crack initiation and propagation in non-planar bi-layers,” Materials Science and Engineering A, vol. 419, no. 1–2, pp. 189–195, Mar. 2006, doi: 10.1016/J.MSEA.2005.12.023.
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