Pengukuran Kemampuan Manufaktur PCB Empat Layer di TFME
Abstract
Saat ini PCB multi-layer banyak digunakan pada rangkaian elektronik karena mampu menyediakan PCB dengan kepadatan komponen yang lebih tinggi, kecepatan tinggi dan ukuran PCB yang relatif lebih kecil dibandingkan dengan PCB single layer. Untuk menjawab kebutuhan pasar, TFME (Teaching Factory Manucacturing of Electronics) yang merupakan salah satu laboratorium di lembaga Politeknik Batam, dirasa perlu melakukan penelitian untuk mengukur kemampuan produksi di bidang manufaktur PCB multi-layer, khususnya empat layer. Total PCB empat layer yang dibuat adalah sejumlah sembilan belas unit. Adapun metoda yang digunakan untuk mengukur kemampuan TFME dalam membuat PCB empat layer adalah dengan cara mengukur kesesuaian koneksi jalur tembaga terhadap desain dan pengecekan visual kesejajaran antar layer menggunakan mesin x-ray. Dari hasil pengujian dapat diketahui bahwa untuk PCB yang menggunakan via ukuran 0.7mm tidak memiliki cacat jalur putus.
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